Developing Micro-Columns of Test Sockets to Enable Processor Validation Signals
Keywords:
micro contact pads, processor, debug interposer, interconnect socket, interconnection microcolumns.Abstract
This study addresses the challenge of optimizing the interconnection between processors and micro contact pads (uADC) during the validation process. The aim is to leverage debug signals to measure and diagnose interfaces in the processors, using a debug interposer as a measurement interface. The uADCs represent an alternative for incorporating additional contacts in validation by occupying a space between commercial processor pads. However, the development of uADCs faces technological challenges such as reducing the contact area and ensuring electrical resistance stability. To address these challenges, the use of an inter-connection socket (SDI) with micro–column interconnect (uCDI) technology, capable of meeting the required conductivity, is proposed. Experimental results demonstrate electrical resistivity measurements below one hundred ohms which is the maximum accepted value within the context of processor validation. The implementation of uADCs and the use of SDI with uCDI offer advantages in the processor validation process by providing access to previously inaccessible signals, setting a precedent for future research in contact miniaturization in commercial products.
References
[1] H. G. Rotithor, "Postsilicon Validation Methodology for Microprocessors", IEEE Design & Test of Computers, pp. 77-88, October 2000.
[2] A. S. Nizam, M. K. Ramadas and M. H. Marhaban, "Interposer Technology in Advanced Packaging for Microelectronic Systems: A Review", Journal of Microelectronics and Electronic Packaging, pp. vol. 13, no. 3, pp. 141-150, 2016.
[3] Y. S. Chen, J. C. Huang and Y. W. Chen, "Design and Optimization of LGA Socket for High-Speed Interconnects", IEEE Transactions on Components, Packaging, and Manufacturing Technology, pp. vol. 9, no. 2, pp. 246-254, 2019.
[4] A. G. Hemmati, "Burn-In Socket Design and Characterization for High-Power Integrated Circuits", Journal of Electronic Testing: Theory and Applications (JETTA, pp. vol. 35, no. 4, pp. 405-414, 2019.
[5] U. Encarnacion, R. Pérez, R. Astro, A. Zenteno and M. J. García, "Framework including an interposer having an atypical shape", in Design and Test Technology Conference, Portland, 2021.
[6] ISC, "ISC International", ISC International, 2017. [Online]. Available: http://www.iscintl21.com/. [Accessed November 2022].
[7] U. Encarnación , R. Pérez, R. Astro, A. Zenteno and M. J. García, "Framework including an interposer having an atypical shape". United States Patent US20220094094A1, 24 March 2022.
[8] L. Zhang, Z. Li and L. Zhang, "Design and Optimization of Micro-Pad Interconnects for IC Packaging", Journal of Microelectronics and Solid-State Electronics, vol. 32, no. 3, pp. 144-150, Mar. 2015.
[9] S. Chen, C. Lee and C. Lin, "Impact of uPad Design on Electrical Performance for 3D IC Packaging", Journal of Electronic Materials, vol. 45, no. 10, pp. 4857-4864, 2016.
[10] Y. L. L. a. C. W. W. M. Y. Liu, "A Study of Micro-Interconnect Technology for IC Packaging", IEEE Transactions on Advanced Packaging, vol. 36, no. 3, pp. 513-520, 2013.
[11] R. Pérez, R. Astro, A. Zenteno, M. J. García and U. Encarnación, "Atypical-Shape Debug Interposer Design Based on High-Density Micropad Technology", in Design and Test Technology Conference, Portland, 2021.
[12] H. Kim, J. J. Kim, J. Park, S. Park, S. Choi, B. Bae, D. Ha, M. Bae and J. Kim, "High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High Performance Package", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 8, pp. 7(8), 1356–1368, August 2017.
[13] M. K. D. C. W. J. Y. J. H. L. C. &. L. K. S. Reddyprakash, "Fabrication of Pressure Conductive Silicone Rubber Socket Device by hape-Controlled Nickel Powders Produced by High-Energy Ball Milling", Advances in Microelectronics and Semiconductor Engineering, vol. 15, no. 19, p. 6670, 2022.
[14] ANSYS, "ANSYS", 8 DECEMBER 2022. [Online]. Encarnación-Robles, U.1*, Pérez-Bustamante, R.2, Arcos-Gutiérrez, H.3Available: https://www.ansys.com/. [Accessed 2022].
[15] D. &. M. T. Huri, "Comparison of the material models in rubber finite element analysis", in IOP Conference Series: Materials Science and Engineering, Novi Sad, 2018.
[16] M. A. F. &. T. D. Hadipeykani, "A molecular dynamics simulation of the glass transition temperature and volumetric thermal expansion coefficient of thermoset polymer-based epoxy nanocomposite reinforced by CNT: A statistical study. Physica A: Statistical Mechanics and its Applications", Science Direct, vol. 546, no. May 15, p. 123995, 2020.
[17] D. J. T. G. C. H. S. &. H. R. Saums, "Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications", IMAPS papers, 52nd 3 (International Symposium on Microelectronics), pp. 10.4071/2380-4505, 2019.
[18] j. Š. Z. C. I. Krajči, "Relationship between conductivity and stress–strain curve of electroconductive composite with SBR or polycaprolactone matrices", European Polymer Journal, vol. , pp. 135-143, 2014.
[19] M. G. A. d. S. M. A. d. S. L. O. &. B. M. M. Vieira, "Natural-based plasticizers and biopolymer films: A review", European Polymer Journal, pp. 47(3), 254–263 , 2011.
[20] S. J. S. K. K. H. &. K. H. J. Heo, "Mechanically resilient integrated electronics realized using interconnected 2D gold-nanosheet elastomeric electrodes", NPG Asia Materials, p. 14(1), 2022.
[21] X. I. J. P. C. M. D. J. &. B. D. Chen, "Temperature dependence of the conductivity in conducting polymer composites", Polymer, vol. 35, no. 24, p. 5256–5258, 1994.
